Key Highlights MediaTek Dimensity 7050 launched as new premium mid-range 5G processor Essentially the rebadged Dimensity 1080 processor Has octa-core CPU and Mali G68-MC4 GPU To power upcoming Realme 11 …
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Key Highlights Latest and most powerful mobile processors – MediaTek Dimensity 7200 vs Qualcomm Snapdragon 870. Detailed comparison of CPU, GPU, memory, and multimedia capabilities. This article will focus on …
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Key Highlights Qualcomm Snapdragon 8 Gen 3 SoC in works Qualcomm to use either 4nm TSMC or 3nm Samsung fabrication process for SD 8 Gen 3 CPU will comprise 2+3+2+1 …
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Key Features MediaTek Dimenisty 9200+ SoC in works Will be an up-scaled version of Dimenisty 9200 SoC Will use 4nm TSMC fabrication process MediaTek is set to launch a new …
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Key Highlights Qualcomm Snapdragon 8 Gen 3 chipset leaked with 1+5+2 architecture Adreno 750 GPU, UFS 4.1 storage tipped Official launch timeline not confirmed yet Qualcomm has been trying to …
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Key Highlights MediaTek Dimensity 9000 and Qualcomm Snapdragon 870 are top chipsets for value flagship smartphones. MediaTek Dimensity 9000 offers better raw performance with 4nm manufacturing process. Qualcomm Snapdragon 870 …
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Key Highlights iQOO Z7, Z7x official launch in China soon iQOO Z7 to use Snapdragon 782 chipset iQOO Z7x will be powered by Snapdragon 695 SoC iQOO is bringing new …
Read MoreKey Highlights Both chipsets offer integrated 5G modems. Qualcomm Snapdragon 780G offers excellent gaming performance, efficient power consumption. Dimensity 8200 5G leads Snapdragon 780G in CPU performance with higher clock …
Read More Key Highlights Dimenisty 8200 is a new flagship mobile chipset from MediaTek Snapdragon 870 has been introduced a while ago Dimensity 8200 is fabricated using 4nm process Snapdragon 870 is …
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Key Features MediaTek launched Dimensity 7200 5G SoC Designed for premium mid-tier phones Supports LPDDR5 RAM and UFS 3.1 storage MediaTek has been ramping up its portfolio with new mobile …
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